Postcoalescence evolution of growth stress in polycrystalline films
Entity
UAM. Departamento de Física de la Materia CondensadaPublisher
American Physical SocietyDate
2013-01-31Citation
10.1103/PhysRevLett.110.056101
Physical Review Letters 110.5 (2013): 056101
ISSN
0031-9007 (print); 1079-7114 (online)DOI
10.1103/PhysRevLett.110.056101Funded by
Work supported by the projects 200960I182 (CSIC), CCG10-UAM/MAT-5537 (Comunidad de Madrid and Universidad Autónoma de Madrid), and AYA2010-22032. A. G.-G. acknowledges the financial support of CSIC under Project No. 201160E053Project
Gobierno de España. AYA2010-22032Editor's Version
http://dx.doi.org/10.1103/PhysRevLett.110.056101Subjects
FísicaRights
© 2013 American Physical SocietyAbstract
The growth stress generated once grains coalesce in Volmer-Weber-type thin films is investigated by time-multiscale simulations comprising complementary modules of (i) finite-element modeling to address the interactions between grains happening at atomic vibration time scales (∼0.1 ps), (ii) dynamic scaling to account for the surface stress relaxation via morphology changes at surface diffusion time scales (∼μs-ms), and (iii) the mesoscopic rate equation approach to simulate the bulk stress relaxation at deposition time scales (h). On the basis of addressing the main experimental evidence reported so far on the topic dealt with, the simulation results provide key findings concerning the interplay between anisotropic grain interactions at complementary space scales, deposition conditions (such as flux and mobility), and mechanisms of stress accommodation-relaxation, which underlies the origin, nature and spatial distribution, and the flux dependence of the postcoalescence growth stress
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Google Scholar:González-González, A.
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Polop Jordá, Celia
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Vasco, E.
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