Morphology evolution of thermally annealed polycrystalline thin films
Entity
UAM. Departamento de Física de la Materia CondensadaPublisher
American Physical SocietyDate
2011-10-31Citation
10.1103/PhysRevB.84.155450
Physical Review B 84.15 (2011): 155450
ISSN
1550-235X (online); 1098-0121 (print)DOI
10.1103/PhysRevB.84.155450Funded by
This paper was supported by the projects F1-54173 (bilateral program CSIC-Conacyt) 200960I182 (CSIC), and CCG10-UAM/MAT-5537 (DGUI-Comunidad de Madrid and Universidad Aut´onoma deMadrid). A.G.G. acknowledges the financial support of the MICINN Spanish Ministry under the project ESP2006-14282-C02-02Project
Gobierno de España. ESP2006-14282-C02-02Editor's Version
http://dx.doi.org/10.1103/PhysRevB.84.155450Subjects
FísicaRights
© 2011 American Physical SocietyAbstract
Investigation of the morphology evolution of annealed polycrystalline Au(111) films by atomic force microscopy and x-ray diffraction leads to a continuous model that correlates such an evolution to local interactions between grains triggering different mechanisms of stress accommodation (grain zipping and shear strain) and relaxation (gap filling and grain rotation). The model takes into consideration findings concerning the in-plane reorientation of the grains during the coalescence to provide a comprehensive picture of the grain-size dependence of the interactions (underlying the origin of the growth stress in polycrystalline systems); and in particular it sheds light on the postcoalescence compressive stress as a consequence of the kinetic limitations for the reorientation of larger surface structures
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Google Scholar:González-González, A.
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Alonzo-Medina, G. M.
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Oliva, A. I.
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Polop Jordá, Celia
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Sacedón, J. L.
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Vasco, E.
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