Morphology evolution of thermally annealed polycrystalline thin films
EntityUAM. Departamento de Física de la Materia Condensada
PublisherAmerican Physical Society
10.1103/PhysRevB.84.155450Physical Review B 84.15 (2011): 155450
ISSN1550-235X (online); 1098-0121 (print)
Funded byThis paper was supported by the projects F1-54173 (bilateral program CSIC-Conacyt) 200960I182 (CSIC), and CCG10-UAM/MAT-5537 (DGUI-Comunidad de Madrid and Universidad Aut´onoma deMadrid). A.G.G. acknowledges the financial support of the MICINN Spanish Ministry under the project ESP2006-14282-C02-02
ProjectGobierno de España. ESP2006-14282-C02-02
Rights© 2011 American Physical Society
Investigation of the morphology evolution of annealed polycrystalline Au(111) films by atomic force microscopy and x-ray diffraction leads to a continuous model that correlates such an evolution to local interactions between grains triggering different mechanisms of stress accommodation (grain zipping and shear strain) and relaxation (gap filling and grain rotation). The model takes into consideration findings concerning the in-plane reorientation of the grains during the coalescence to provide a comprehensive picture of the grain-size dependence of the interactions (underlying the origin of the growth stress in polycrystalline systems); and in particular it sheds light on the postcoalescence compressive stress as a consequence of the kinetic limitations for the reorientation of larger surface structures
Google Scholar:González-González, A. - Alonzo-Medina, G. M. - Oliva, A. I. - Polop Jordá, Celia - Sacedón, J. L. - Vasco, E.
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