Dynamic bonding of metallic nanocontacts: Insights from experiments and atomistic simulations
Entidad
UAM. Departamento de Física de la Materia CondensadaEditor
American Physical SocietyFecha de edición
2016-02-26Cita
10.1103/PhysRevB.93.085437
Physical Review B - Condensed Matter and Materials Physics 93.8 (2016): 085437
ISSN
2469-9950 (print); 2469-9969 (online)DOI
10.1103/PhysRevB.93.085437Financiado por
W. Dednam thanks Dr. A. E. Botha for helpful discussions and acknowledges support from the National Research Foundation of South Africa through the Scarce Skills Masters scholarship funding programme (Grant Unique Number 92138). This work is supported by the Generalitat Valenciana through Grant Reference PROMETEO2012/011 and MINECO under Grant No. FIS2013-47328, by European Union structural funds and the Comunidad de Madrid Programs S2013/MIT-3007 and P2013/MIT-2850. This work is also part of the research programme of the Foundation for Fundamental Research on Matter (FOM), which is financially supported by the Netherlands Organisation for Scientific Research (NWO)Proyecto
Gobierno de España. FIS2013-47328; Comunidad de Madrid. S2013/MIT-3007/MAD2D; Comunidad de Madrid. S2013/MIT-2850/NANOFRONTMAG-CMVersión del editor
http://dx.doi.org/10.1103/PhysRevB.93.085437Materias
Metallic nanocontacts; Atomistic simulations; FísicaDerechos
© 2016 American Physical SocietyResumen
The conductance across an atomically narrow metallic contact can be measured by using scanning tunneling microscopy. In certain situations, a jump in the conductance is observed right at the point of contact between the tip and the surface, which is known as "jump to contact" (JC). Such behavior provides a way to explore, at a fundamental level, how bonding between metallic atoms occurs dynamically. This phenomenon depends not only on the type of metal but also on the geometry of the two electrodes. For example, while some authors always find JC when approaching two atomically sharp tips of Cu, others find that a smooth transition occurs when approaching a Cu tip to an adatom on a flat surface of Cu. In an attempt to show that all these results are consistent, we make use of atomistic simulations; in particular, classical molecular dynamics together with density functional theory transport calculations to explore a number of possible scenarios. Simulations are performed for two different materials: Cu and Au in a [100] crystal orientation and at a temperature of 4.2 K. These simulations allow us to study the contribution of short- and long-range interactions to the process of bonding between metallic atoms, as well as to compare directly with experimental measurements of conductance, giving a plausible explanation for the different experimental observations. Moreover, we show a correlation between the cohesive energy of the metal, its Young's modulus, and the frequency of occurrence of a jump to contact
Lista de ficheros
Google Scholar:Fernández, M. A.
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Sabater, C.
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Dednam, W.
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Palacios Burgos, Juan José
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Calvo, M. R.
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Untiedt, C.
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Caturla, M. J.
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