Waveguide manufacturing technologies for next-generation millimeter-wave antennas
Entity
UAM. Departamento de Tecnología Electrónica y de las ComunicacionesPublisher
MDPIDate
2021-12-16Citation
10.3390/mi12121565
Micromachines 12.12 (2021): 1565
ISSN
2072-666X (online)DOI
10.3390/mi12121565Funded by
This work was supported by the Spanish Government under Grant TEC2016-76070- C3-1/2-R (ADDMATE); in part under Grant PID2020-116968RB-C32/33 (DEWICOM), Agencia Estatal de Investigación MCIN/AEI/10.13039/501100011033, Fondo Europeo de Desarrollo Regional: AEI/FEDER, UE. This work was also partially supported under Grant S2013/ICE3000 (SPADERADARCM), Madrid Regional GovernmentProject
Gobierno de España. TEC2016-76070- C3-1/2-R; Gobierno de España. PID2020-116968RB-C32/33; Gobierno de España. MCIN/AEI/10.13039/501100011033; Comunidad de Madrid. S2013/ICE3000Editor's Version
https://doi.org/10.3390/mi12121565Subjects
Millimeter-wave devices; Waveguide manufacturing by direct metal laser sintering; Waveguide manufacturing by stereolithography; Waveguide manufacturing by subtractive machining; TelecomunicacionesRights
© The author(s)Abstract
Some recent waveguide-based antennas are presented in this paper, designed for the next generation of communication systems operating at the millimeter-wave band. The presented prototypes have been conceived to be manufactured using different state-of-the-art techniques, involving subtractive and additive approaches. All the designs have used the latest developments in the field of manufacturing to guarantee the required accuracy for operation at millimeter-wave frequencies, where tolerances are extremely tight. Different designs will be presented, including a monopulse antenna combining a comparator network, a mode converter, and a spline profile horn; a tunable phase shifter that is integrated into an array to implement reconfigurability of the main lobe direction; and a conformal array antenna. These prototypes were manufactured by diverse approaches taking into account the waveguide configuration, combining parts with high-precision milling, electrical discharge machining, direct metal laser sintering, or stereolithography with spray metallization, showing very competitive performances at the millimeter-wave band till 40 GHz
Files in this item
Google Scholar:Polo-López, Lucas
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Sanchez-Olivares, Pablo
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García-Marín, Eduardo
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Ruiz Cruz, Jorge Alfonso
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Córcoles Ortega, Juan
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Masa Campos, José Luis
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Montejo-Garai, José R.
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Rebollar, Jesús M.
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